发明名称 FLAT CONDUCTIVE PARTICLE MANUFACTURING METHOD, FLAT CONDUCTIVE PARTICLE, AND RESIN COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To enable high-precision classification processing to be performed for flat conductive particles at a relatively high speed.SOLUTION: A flat conductive particle manufacturing method comprises a flat conductive particle manufacturing step and a wet classification step. The flat conductive particle manufacturing step manufactures flat conductive particles. The wet classification step uses wet sieve classification to classify flat conductive particles. In the flat conductive particle manufacturing step of this flat conductive particle manufacturing method, flat conductive particles are preferably manufactured in a wet method.</p>
申请公布号 JP2015046402(A) 申请公布日期 2015.03.12
申请号 JP20140216402 申请日期 2014.10.23
申请人 SUMITOMO BAKELITE CO LTD 发明人 OKUBO HIKARI;KONDO CHIAKI
分类号 H01B13/00;H01B5/00 主分类号 H01B13/00
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