Apparatus and Method for a Component Package

摘要

A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device. Each interposer may include conductive traces formed therein to provide electrical coupling to conductive features formed on the surfaces of the respective interposers. A plurality of through vias may provide for electrically connecting the interposers to one another. A first interposer may provide for electrical connections to a printed circuit board or subsequent semiconductor device. A second interposer may provide for electrical connections to a second semiconductor device and a second component package. The first and second component packages may be combined to form a Package-on-Package (“PoP”) structure.

主权项

1. An apparatus, comprising:
a first semiconductor device; a second semiconductor device; a first redistribution layer (RDL) electrically coupled to a first side of the first semiconductor device; a second RDL positioned on a second side of the first semiconductor device, the second RDL electrically coupled to the second semiconductor device; a first material positioned between the first RDL and the second RDL; and a plurality of through vias extending through the first material, the through vias to electrically couple the first RDL to the second RDL.