发明名称 |
ELECTRONIC-COMPONENT-EQUIPPED SUBSTRATE AND METHOD FOR PRODUCING SAME |
摘要 |
A method for producing an electronic-component-equipped substrate obtained by mounting an electronic component (14) onto one principal surface of a metal plate (10) comprising copper, or (in the case that a copper-plating film (20) is formed on the front surface thereof) aluminum or an aluminum alloy, wherein: a surface treatment causing surface roughness to be 0.4μm or higher is performed by roughening the one principal surface (or the surface having the copper-plating film (20)) (i.e. the surface to which the electronic component (14) is to be mounted) of the metal plate (10); a silver paste is applied to said principal surface (or the surface having the copper-plating film (20)), and the electronic component (14) is positioned thereon; thereafter, a silver bonding layer (12) is formed by sintering the silver in the silver paste; and the electronic component (14) is bonded to the one principal surface (or the surface having the copper-plating film (20)) of the metal plate (10) by the silver bonding layer (12). |
申请公布号 |
WO2015034078(A1) |
申请公布日期 |
2015.03.12 |
申请号 |
WO2014JP73599 |
申请日期 |
2014.09.02 |
申请人 |
DOWA METALTECH CO., LTD. |
发明人 |
SUNACHI, NAOYA;OSANAI, HIDEYO;KURITA, SATORU |
分类号 |
H01L21/52;H01L23/12;H01L23/13;H05K3/32 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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