| 摘要 |
PROBLEM TO BE SOLVED: To facilitate a circuit design considering impedance when a high frequency circuit is formed on a multilayer printed board.SOLUTION: When two resin films 101, 102 are laminated so that surfaces 10b having no conductor pattern 11 formed thereon confront each other and other resin films 103 are laminated so that a surface 10a having the conductor pattern 11 formed thereon and a surface 10b having no conductor pattern 11 formed thereon confront each other, resin films having the same resin thickness d3 are used as the other resin films 103, and resin films in which the total resin film of the film thicknesses d1, d2 thereof are equal to the resin thickness d3 of one of the other resin films are used as the two resin films 101, 102. Accordingly, the thicknesses of the dielectric materials of the conductor patterns 11 of the adjacent resin films 10 can be made coincident with each other, and impedance can be easily calculated, so that the circuit design can be facilitated. |
