发明名称 METALLIC MATERIAL FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING THE SAME, AND CONNECTOR TERMINAL, CONNECTOR AND ELECTRONIC COMPONENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a metallic material for an electronic component having excellent slight slide wear properties in addition to insertion force, solder solderability and corrosion resistance, and a connector, a connector and an electronic component using the same.SOLUTION: Provided is a metallic material for an electronic component comprising: a base material; a lower layer formed on the base material and composed of one or more kinds selected from an A constituent element group as a group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer; and an upper layer composed of one or more kinds of alloys selected from a C constituent element group as a group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir. The surface of the upper layer is further provided with a treated layer. In the treated layer, the concentration of one or more kinds of metals selected from the metallic element groups composing the lower layer, the intermediate layer and the upper layer, one or ore kinds selected from a group consisting of O, C, S, P and N, and In in the In element satisfies 0.1 to 10 at%.
申请公布号 JP2015045056(A) 申请公布日期 2015.03.12
申请号 JP20130176122 申请日期 2013.08.27
申请人 JX NIPPON MINING & METALS CORP 发明人 FURUSAWA HIDEKI
分类号 C25D5/10;C22C5/02;C22C5/04;C22C5/06;C22C5/08;C22C5/10;C22C9/00;C22C9/02;C22C9/04;C22C9/05;C22C9/06;C22C9/08;C22C13/00;C22C13/02;C22C19/03;C22C19/07;C22C22/00;C22C27/06;C22C38/00;C23C28/00;C25D5/50;C25D7/00;C25D9/06;C25D9/08;H01B5/02;H01B13/00 主分类号 C25D5/10
代理机构 代理人
主权项
地址