发明名称 LAMINATE, CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, AND METHOD FOR PRODUCING LAMINATE
摘要 It is an object of the present invention to provide a laminate, such as a conductive pattern, having an excellent adhesion at the interfaces between a layer that serves as a support and a conductive layer containing a conductive material and between the conductive layer and a plating layer. The present invention provides a laminate at least including a support layer (I), a conductive layer (II) having an oxidized surface, and a plating layer (III) formed on the oxidized surface of the conductive layer (II); the present invention also provides a conductive pattern and electric circuit each including such a laminate.
申请公布号 US2015068907(A1) 申请公布日期 2015.03.12
申请号 US201314389688 申请日期 2013.03.28
申请人 DIC Corporation 发明人 Fujikawa Wataru;Saitou Yukie;Murakawa Akira;Shirakami Jun
分类号 H05K1/02;H05K3/02;C25D3/02;H05K3/38;H05K1/09;H05K3/18 主分类号 H05K1/02
代理机构 代理人
主权项 1. A laminate comprising a support layer (I), a conductive layer (II), and a plating layer (III), wherein the conductive layer (II) has an oxidized surface, and the plating layer (III) is disposed on the oxidized surface of the conductive layer (II).
地址 Tokyo JP