发明名称 |
LAMINATE, CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, AND METHOD FOR PRODUCING LAMINATE |
摘要 |
It is an object of the present invention to provide a laminate, such as a conductive pattern, having an excellent adhesion at the interfaces between a layer that serves as a support and a conductive layer containing a conductive material and between the conductive layer and a plating layer. The present invention provides a laminate at least including a support layer (I), a conductive layer (II) having an oxidized surface, and a plating layer (III) formed on the oxidized surface of the conductive layer (II); the present invention also provides a conductive pattern and electric circuit each including such a laminate. |
申请公布号 |
US2015068907(A1) |
申请公布日期 |
2015.03.12 |
申请号 |
US201314389688 |
申请日期 |
2013.03.28 |
申请人 |
DIC Corporation |
发明人 |
Fujikawa Wataru;Saitou Yukie;Murakawa Akira;Shirakami Jun |
分类号 |
H05K1/02;H05K3/02;C25D3/02;H05K3/38;H05K1/09;H05K3/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A laminate comprising a support layer (I), a conductive layer (II), and a plating layer (III), wherein the conductive layer (II) has an oxidized surface, and the plating layer (III) is disposed on the oxidized surface of the conductive layer (II). |
地址 |
Tokyo JP |