Semiconductor device having a thermoelectric module
摘要
<p>A heat spreader is formed on a first semiconductor package and a second semiconductor package which is adjacent to the first semiconductor package. First and second thermoelectric devices are formed between the heat spreader and the first and second semiconductor packages. The polarity of the first thermoelectric device is opposite to the polarity of the second thermoelectric device. The heat spreader heated by the first thermoelectric device is cooled by the operation of the second thermoelectric device.</p>
