| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of a void in an encapsulation resin in a gap between a wiring board and an overhang part which is formed by a plurality of semiconductor chips mounted by lamination on the wiring board.SOLUTION: A semiconductor device 10 has a wiring board 11, a first semiconductor chip 12 and a second semiconductor chip 13. The wiring board includes a first surface and a first recess 116 formed on the first surface. A part of the wiring board where the first recess is formed is thinner than a peripheral part of the wiring board. The first semiconductor chip is mounted on the first surface of the wiring board and one edge is arranged adjacent to the first recess. The second semiconductor chip is stacked on the first semiconductor chip to form an overhang part extending from edges of the first semiconductor chip. The second semiconductor chip includes a first principal surface opposite to the wiring board, a second principal surface on an opposite side to the first principal surface and electrode pads 131 formed on the second principal surface. The electrode pads are arranged in a direction perpendicular to the first recess of the wiring board. |
