发明名称 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of correcting an offset component even if the offset component is contained in an output value after an adjustment value is written to storage means.SOLUTION: A circuit chip 20 includes: a dielectric member 29 arranged in each of offset adjustment units 27 and 28 corresponding to a distance that eliminates a difference between a first offset capacitance formed out of a first wire 40 and a third wire 42 among a plurality of first offset adjustment units 27 and a plurality of second offset adjustment units 28 and a second offset capacitance formed out of a second wire 41 and a third wire 42. It is thereby possible to readjust an offset component contained in an output value from the circuit chip 20 even if the offset component is contained in the output value from the circuit chip 20 after an adjustment value is written to a memory 23.
申请公布号 JP2015045597(A) 申请公布日期 2015.03.12
申请号 JP20130177568 申请日期 2013.08.29
申请人 DENSO CORP 发明人 TAKADA SATOSHI
分类号 G01P21/00;G01P15/08;G01P15/125;H01L29/84 主分类号 G01P21/00
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