LEAD-FREE TIN ALLOY ELECTROPLATING COMPOSITIONS AND METHODS

摘要

PROBLEM TO BE SOLVED: To provide lead-free tin alloy electroplating compositions and methods.SOLUTION: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.