METALLIC MATERIAL FOR ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a metallic material for an electronic component having low whisker resistance, low adhesion abrasion characteristics, and high durability; and a connector terminal, a connector, and an electronic component using the same.SOLUTION: A metallic material for an electronic component includes: a base material; a lower layer formed on the base material and constituted by one, two, or more types selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co, and Cu; a middle layer formed on the lower layer; and an upper layer formed on the middle layer and constituted by an alloy including one or two types selected from a constituent element group B consisting of Sn and In, and one, two, or more types selected from a constituent element group C consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir. An XPS survey measurement of a surface of the upper layer satisfies I/(I+I)≥0.1, where Iis a zero-valent detection intensity, and Iis bivalent and tetrad detection intensity of photoelectron spectrum of 3d orbit of Sn.