ATTACHMENT JIG AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an attachment jig excellent in transportability and capable of precisely attaching a resin sheet on an electronic component, and a method for easily manufacturing an electronic device using the attachment jig.SOLUTION: A sealing jig 1 includes: a base plate 7 configured such that a sealing sheet 3 is placed thereon; a spacer 5 configured to be placed on the base plate 7 so as to expose the sealing sheet 3 upwards and having a thickness thinner than that of the sealing sheet 3; a spring 8 configured to leave a separating interval above the sealing sheet 3 and to support an optical semiconductor component 2; and an upper plate 6 configured to face the base plate 7 in the vertical direction and to be placed above the optical semiconductor component 2.