| 发明名称 |
VIA NETWORK STRUCTURES AND METHOD THEREFOR |
| 摘要 |
A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact. |
| 申请公布号 |
US2015072520(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414514570 |
申请日期 |
2014.10.15 |
| 申请人 |
NXP B.V. |
发明人 |
Li Yuan;Nath Som;van Dort Maarten |
| 分类号 |
H01L21/768;H01L23/00 |
主分类号 |
H01L21/768 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit device providing a surface over a structural aspect of the integrated circuit device, the device comprising:
at least one bond pad contact at the surface; at least one via network layer below each bond pad contact and connecting the bond pad contact with a metal layer, each via network layer including a plurality of via strips configured and arranged extending about parallel to the surface and in different directions to facilitate structural support of the bond pad contact; and an insulating material between the via strips in each layer. |
| 地址 |
Eindhoven NL |
