| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
| 摘要 |
A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region. |
| 申请公布号 |
US2015069445(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414493833 |
申请日期 |
2014.09.23 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JUNG Su Jung;KIM 8yung Mok;CHO Young Jun;KWON Seo Yean |
| 分类号 |
H01L33/64;H01L33/60;H01L33/48;H01L33/62 |
主分类号 |
H01L33/64 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package comprising:
a package body having a cavity composed of a side surface and a bottom, wherein the package body has a structure in which a plurality of layers is laminated and the cavity is formed by the plurality of layers; a heat radiating member disposed under the cavity of the package body; a light emitting device disposed on the heat radiating member; a bonding member disposed between the light emitting device and the heat radiating member; and a bonding member fixing layer disposed in the cavity and covering a side surfaces of the bonding member and the light emitting device, wherein the bonding member fixing layer forms the bottom of the cavity. |
| 地址 |
Seoul KR |
