LED COMPONENT BY INTEGRATING EPITAXIAL STRUCTURE AND PACKAGE SUBSTRATE TOGETHER AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention discloses an integral LED component which integrates LED epitaxial structure electrodes and interconnects with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.

主权项

1. An integral LED component, mounted into a hollow area of a hollow carrier, the hollow carrier having two conductive electrodes with opposite polarities used for connecting to an external power, the integral LED component comprising:
a substrate, having an upper surface and a lower surface; an LED epitaxial structure, formed on the upper surface of the substrate, the LED epitaxial structure comprising at least one first electrode and at least one second electrode, wherein the polarities of the at least one first electrode and the at least one second electrode are opposite; and at least one third electrode and at least one fourth electrode, formed on the upper surface and located outside the LED epitaxial structure, the at least one third electrode and the at least one fourth electrode are electrically connected to the at least one first electrode and the at least one second electrode to form a circuit, wherein the polarities of the at least one third electrode and the at least one fourth electrode are opposite; wherein the two conductive electrodes of the hollow carrier are used for electrically connecting the at least one third electrode and the at least one fourth electrode of the substrate, the lower surface of the substrate is exposed to the hollow carrier, and the substrate is supported by the hollow carrier so that the substrate can be flatly mounted and contacted with a heat conductive or a dissipation device.