摘要 |
A liquid glass application, which uses the liquid glass to prepare a substrate provided with a conductive column, a substrate embedded with a circuit and a glass membrane. The liquid glass possesses a large number of usage convenience features. Therefore, a preparation cost can be greatly reduced. Besides, a traditional glass configuration limit is broken, and a glass thickness can be reduced remarkably, which meet a nowadays requirements of lightness, thinness, and shortness on electronic products. |