发明名称 HIGHLY HEAT CONDUCTIVE POLYIMIDE FILM, HIGHLY HEAT CONDUCTIVE METAL-CLAD LAMINATE AND METHOD FOR PRODUCING SAME
摘要 <p>Provided is a highly heat conductive metal-clad laminate which shows heat resistance, dimensional stability, workability, and adhesiveness and excellent thermal conductivity properties. Also provided is a highly heat conductive polyimide film. The highly heat conductive metal-clad laminate has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt%, the heat conductive filler contains a plate-like filler with an average length D L of 0.1-15µm and a spherical filler with an average particle diameter D R of 0.05-10µm, D L and D R satisfy the relationship D L >D R /2, no heat conductive filler of 30 µmor more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.</p>
申请公布号 KR101501957(B1) 申请公布日期 2015.03.12
申请号 KR20117007207 申请日期 2009.09.07
申请人 发明人
分类号 B32B15/08;B32B15/16;C08J5/18;H05K1/03 主分类号 B32B15/08
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