发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device that detects a temperature with high accuracy and detects overheat in quick response to heating of a transistor.SOLUTION: A lead 12 and bonding pads 14, 15 formed on a semiconductor chip 13 are interconnected by bonding wires 16, 17. A drain-source voltage V1 of a transistor 19 turned on is a value of dividing a voltage Vo of the lead 12 according to a resistance of the bonding wire 16 and an on resistance of the transistor 19. Since both resistances have different temperature coefficients, the voltage division ratio changes with temperature. A reference voltage V2 is a value of dividing the voltage Vo in a voltage division circuit 22, and the voltage division ratio is independent of temperature and constant. A comparator 27 outputs a temperature determination signal St at an L level indicating overheat on condition of V1≥V2.
申请公布号 JP2015046543(A) 申请公布日期 2015.03.12
申请号 JP20130178003 申请日期 2013.08.29
申请人 DENSO CORP 发明人 UENISHI ATSUSHI
分类号 H01L21/822;H01L27/04;H02H5/04;H02H7/00 主分类号 H01L21/822
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