ANGULAR VELOCITY SENSOR

摘要

The present invention enhances the performance of an in-plane angular velocity sensor capable of detecting an angular velocity around an x-axis direction and an angular velocity around a y-axis direction. A semiconductor chip (CHP1) having an angular velocity sensor element formed therein includes a device layer (DL) and a cap layer (CAPL). The device layer (DL) has, formed therein, a vibrating element (105) capable of vibrating within a zx plane that includes the thickness direction of a support substrate (1S) and a detection unit capable of capturing, as a change in capacitance, the displacement in an xy plane perpendicular to the zx plane caused by Coriolis force generated by angular velocity applied around an axis of rotation included in the xy plane. The cap layer (CAPL) has fixed driving electrodes (106b, 107b) that have a voltage applied thereto that is for causing the vibrating element (105) to vibrate within the zx plane.