发明名称 プラズマ処理装置及びプラズマ処理装置用の電極
摘要 A plasma processing apparatus includes a processing chamber in which a target object is processed by a plasma, a first and a second electrode that are provided in the processing chamber to face each other and have a processing space therebetween, and a high frequency power source that is connected to at least one of the first and the second electrode to supply a high frequency power to the processing chamber. And at least one of the first and the second electrode includes a base formed of a plate-shaped dielectric material and a resistor formed of a metal and provided between the base and the plasma.
申请公布号 JP5683822(B2) 申请公布日期 2015.03.11
申请号 JP20100047788 申请日期 2010.03.04
申请人 東京エレクトロン株式会社 发明人 檜森 慎司;林 大輔
分类号 H01L21/3065;C23C16/509;H01L21/205;H05H1/46 主分类号 H01L21/3065
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