| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a measuring method and a measuring apparatus capable of accurately measuring a thickness of a protective film formed on a workpiece surface. <P>SOLUTION: The measuring method of the invention comprises: a step of forming a protective film 61 containing a light absorption agent on a wafer W; a step of irradiating the protective film 61 with a measuring beam and receiving the light emitted from the protective film 61 by absorption of the measuring beam; and a step of referencing measurement data indicating change of the optical spectrum by light emission of the protective film 61 for change of the thickness of the protective film 61 manufactured in advance and measuring the thickness of the protective film 61 from the light emission intensity of the protective film 61. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
