METHOD FOR TREATING SUBSTRATE

摘要

An embodiment of the present invention provides a method and an apparatus for applying a chemical solution on a substrate. The method for applying the chemical solution on the substrate comprises the steps of: removing bubbles remaining in a buffer space provided in a nozzle; preliminarily discharging the chemical solution so as to adjust a pressure of the buffer space; and applying the chemical solution while the nozzle is moving along one direction above the substrate. Since the step of removing the bubbles and the step of preliminarily discharging are performed at the same time, it is possible to reduce the consumption of the chemical solution in the step of removing the bubbles.