| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesion evaluation method capable of quantitatively evaluating adhesion between a base material and a thin film. <P>SOLUTION: An adhesion evaluation method related to the present invention is the adhesion evaluation method for evaluating adhesion between a base material and a thin film formed thereon, including a peeling process for peeling the thin film from the base material with the use of a cutting blade. The peeled thin film includes a first bending part and a second bending part adjacent to the first bending part. The method also includes: a peeling area calculation process for calculating the peeling area of the thin film to be held between the first bending part and the second bending part; a horizontal force acquisition process for obtaining the horizontal force F<SB POS="POST">H</SB>of the cutting blade when peeling the thin film; a peeling energy calculation process for calculating peeling energy to be required in the peeling on the basis of the product of the integrated value of the horizontal force F<SB POS="POST">H</SB>and the horizontal velocity V of the cutting blade in a time section ta including the maximum value of the horizontal force F<SB POS="POST">H</SB>; and a unit peeling energy calculation process for calculating unit peeling energy per unit area by dividing the peeling energy by the peeling area. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
