发明名称 Solid-state image sensor
摘要 <p>A solid-state image sensor (1) includes: an imaging device wafer (2A); a plurality of imaging devices (3) which are formed on the imaging device wafer (2A); a spacer (5) which surrounds the imaging devices (3) on the imaging device wafer (2A) and is joined to the imaging device wafer (2A) with an adhesive (7); a transparent protection member (4) which covers the imaging devices (3) on the imaging device wafer (2A) and is attached on the spacer (5); and a plurality of electrostatic discharge protection devices (10A) which are formed on the imaging device wafer (2A), the electrostatic discharge protection devices (10A) being positioned under the spacer (5), each of the electrostatic discharge protection devices (10A) having diffusion layers (12, 13) and a well layer (11) between the diffusion layers (12, 13), the well layer (11) being provided with a channel stopper (20).</p>
申请公布号 EP2573814(B1) 申请公布日期 2015.03.11
申请号 EP20120198378 申请日期 2007.09.27
申请人 FUJIFILM CORPORATION;FUJIFILM PHOTONIX CO., LTD. 发明人 TAKASAKI, KOSUKE;IESAKA, MAMORU;WAKO, HIDEKI
分类号 H01L27/146;H01L23/02;H01L23/60 主分类号 H01L27/146
代理机构 代理人
主权项
地址