发明名称 積層型セラミック電子部品の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated ceramic electronic component in which flatness of the surface is enhanced. <P>SOLUTION: There is a tendency that a protrusion is formed because a part of a ceramic green sheet, where many via hole conductors or conductive films are laminated, expands after calcination. Based on the location information and the height information of a protrusion generated in a calcined laminate for sample, a recess 24a is formed in a region on the surface of a raw laminate 24 for product where expansion is predicted, and then the raw laminate 24 for product is calcined. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5682342(B2) 申请公布日期 2015.03.11
申请号 JP20110019468 申请日期 2011.02.01
申请人 发明人
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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