发明名称 PROCESS FOR FORMING A CRACK IN A MATERIAL
摘要 <p>A process for forming a layer (26) of semiconductor material from a substrate (20), or donor substrate, made of the same semiconductor material is described, comprising: formation in said donor substrate of a high lithium concentration zone (22), with a concentration between 5×1018 atoms/cm3 and 5×1020 atoms/cm3, then a hydrogen implantation (24) in the donor substrate, in, or in the vicinity of, the high lithium concentration zone, application of a stiffener (19) with the donor substrate, application of a thermal budget to result in the detachment of the layer (34) defined by the implantation.</p>
申请公布号 EP2705529(B1) 申请公布日期 2015.03.11
申请号 EP20120723839 申请日期 2012.04.27
申请人 COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIESALTERNATIVES 发明人 TAUZIN, AURÉLIE;MAZEN, FRÉDÉRIC
分类号 H01L21/762 主分类号 H01L21/762
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