| 摘要 |
A solder mask contains: a dispersant added at 0.1 to 1 wt% of a total content in the solder mask, an adhesive added at 0 to 20 wt% of the total content in the solder mask, solder powders added at 1 to 60 wt% of the total content in the solder mask, and a solvent added at 20 to 99 wt% of the total content in the solder mask. Also disclosed is a method of manufacturing a solder mask contains steps of: providing a first solution in which a dispersant and an ink solvent are mixed; mixing the first solution with an adhesive to form a second solution; and mixing solder powders with the second solution evenly to form the solder mask. The solder mask may be coated on a printed circuit board (PCB) and a substrate of a LED element to form a conductive heat dissipation layer on the printed circuit board (PCB) and the substrate of the LED element, thus dissipating heat, prolonging lifespan, and enhancing luminescence of the LED element, such as a LED chip. |
