发明名称 ELECTROPLATING APPARATUS FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
摘要 <p>Provided is an electroplating apparatus. The electroplating apparatus comprises: a tub; a plurality of rolls; at least one cathode roll; at least one electroplating anode; and a separating trough. In this case, the separating trough is located inside the tub, and at least one surface of the separating trough has a plurality of holes. An electroplating solution is supplied to the tub through the separating trough or the bottom of the tub and is basically spread toward an electroplated article near the electroplating anode.</p>
申请公布号 KR20150026728(A) 申请公布日期 2015.03.11
申请号 KR20140003441 申请日期 2014.01.10
申请人 FLEX TEK CO., LTD. 发明人 TSAI SUI HO
分类号 C25D17/00;C25D7/12;H05K3/18 主分类号 C25D17/00
代理机构 代理人
主权项
地址