| 摘要 |
<p>Provided is an apparatus for processing a substrate, which is capable of reducing a water-film thickness between a central portion and an edge portion of the substrate. The apparatus for processing a substrate includes a substrate support member on which a substrate is placed; and a spray member for supply liquid onto the substrate placed on the substrate support member, wherein the spray member includes a driving member for rotating or vertically driving a nozzle arm, and a nozzle installed to the nozzle arm to form an acute angle with respect to a surface of the substrate and spray liquid.</p> |
