| 摘要 |
<p>According to one embodiment, a semiconductor device is provided such that a penetrating via with a conductive material embedded through a medium of an insulating film is formed in a through hole of a p-type semiconductor substrate. The semiconductor device includes an n-type well on an upper section of the p-type semiconductor substrate in the vicinity of the penetrating via, an electrode connected to the n-type well, and the electrode connected to the p-type semiconductor substrate in the vicinity of the electrode.</p> |
