发明名称 メタルブリッジ型記憶装置の製造方法
摘要 <p>According to one embodiment, a conductive bridging memory device includes a first wiring layer having a plurality of first wiring portions extending in a first direction, a second wiring layer having a plurality of second wiring portions extending in a second direction crossing the first direction, and a resistance change layer provided continuously along a plane having the first direction and the second direction between the first wiring layer and the second wiring layer. Each of the first wiring portions includes a first wiring extending in the first direction. Each of the second wiring portions includes a second wiring extending in the second direction, and an ion metal layer provided between the second wiring and the resistance change layer and extending in the second direction.</p>
申请公布号 JP5684104(B2) 申请公布日期 2015.03.11
申请号 JP20110286094 申请日期 2011.12.27
申请人 发明人
分类号 H01L27/105;H01L45/00;H01L49/00 主分类号 H01L27/105
代理机构 代理人
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