| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical sensor device which allows a light receiving surface of an optical sensor device to be exposed from a sealing member without etching the sealing member, and to provide the optical sensor device. <P>SOLUTION: A manufacturing method of an optical sensor device includes: a process in which a light receiving surface 16 of an IR element 10 is bonded to a region exposed from a lead frame 30' which is a surface having adhesiveness of an adhesive tape; a process in which an IC element 20 is attached to a surface of the lead frame 30'; a process in which the lead frame 30' and the IC element 20 are electrically connected with a wire 45; a process in which the IR element 10 and the IC element 20 are electrically connected with a wire 46; a process in which the IR element 10, the IC element 20, and the wires 45, 46 are covered with a molding resin 49; a process in which the adhesive tape is removed from the molding resin 49 and the lead frame 30'; and a process in which the molding resin 49 and the lead frame 30' are cut along a dicing street 36 and a package is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
