| 摘要 |
A sealed substrate is cut by correcting the misalignment of a cutting line before a cutting process, even though the position of the cutting line is misaligned from a pre-alignment point due to the thermal deformation of the sealed substrate. In the cutting device (1) of a twin cut table method, an alignment mask is photographed just before the sealed substrate (3) is cut, by a camera (13) for checking kerf installed by integrating with a spindle unit (10B). Even though the sealed substrate (3) is cooled and contracted by the effect of cutting water and cooling water, a control part (CTL) corrects the misalignment from the cutting line set at the pre-alignment point just before a cutting process, based on the position of the photographed alignment mask. A sealed substrate (3) can be cut along a corrected cutting line. |
