发明名称 |
THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY |
摘要 |
Provided is a thermoplastic resin which (A) remarkably improves thermal conductivity of a resin composition when a thermally conductive filler is added and (B) can be injection-molded even by use of a general injection-molding die. The thermoplastic resin is a resin wherein: a main chain which mainly has a specific repeating unit; and 60 mol% or more ends of molecular chains are carboxyl groups. |
申请公布号 |
EP2562200(A4) |
申请公布日期 |
2015.03.11 |
申请号 |
EP20110771732 |
申请日期 |
2011.04.14 |
申请人 |
KANEKA CORPORATION |
发明人 |
YOSHIHARA, SHUSUKE;EZAKI, TOSHIAKI;MATSUMOTO, KAZUAKI |
分类号 |
C08G63/00;C08G63/185;C08G63/68;C08G63/685;C08K3/00;C08K3/28;C08K13/04;C08L67/00 |
主分类号 |
C08G63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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