发明名称 THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY
摘要 Provided is a thermoplastic resin which (A) remarkably improves thermal conductivity of a resin composition when a thermally conductive filler is added and (B) can be injection-molded even by use of a general injection-molding die. The thermoplastic resin is a resin wherein: a main chain which mainly has a specific repeating unit; and 60 mol% or more ends of molecular chains are carboxyl groups.
申请公布号 EP2562200(A4) 申请公布日期 2015.03.11
申请号 EP20110771732 申请日期 2011.04.14
申请人 KANEKA CORPORATION 发明人 YOSHIHARA, SHUSUKE;EZAKI, TOSHIAKI;MATSUMOTO, KAZUAKI
分类号 C08G63/00;C08G63/185;C08G63/68;C08G63/685;C08K3/00;C08K3/28;C08K13/04;C08L67/00 主分类号 C08G63/00
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