PLATE TYPE HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE WITH THE SAME

摘要

Provided are a plate type heat dissipation device which dissipates heat by being attached to heat source elements of an electronic device and the electronic device including the same. The plate type heat dissipation device includes: a first case; a fine fiber organic body which is formed in the first case and is formed with fine fiber having an internal channel capable of a capillary transport of liquid; and a second case which faces the first case at a distance from the fine fiber organic body, is connected with the first case on the edge, and forms a support protrusion pressing the fine fiber organic body in one united body by partially protruding toward the fine fiber organic body. A liquid flow is formed by making refrigerant liquid pass through the fine fiber organic body. Refrigerant gas evaporated from the refrigerant liquid forms a gas flow in a space between the fine fiber organic body and the second case.