| 摘要 |
<p>The present invention relates to a method of aligning an inspection object, such as a printed circuit board adopted in manufacturing an SSD. The method comprises the steps of: grasping the inspection object; verifying whether an alignment state of the inspection object is normal or abnormal in grasping; performing a subsequent process when the alignment state is normal, and correcting the alignment state in a member itself grasping the inspection object or transferring the inspection object to an alignment member to correct the alignment state when the alignment state is abnormal; and performing the subsequent process when the corrected alignment state of the inspection object is normal, and providing an alarm when the corrected alignment state is abnormal.</p> |
