RESIN COMPOSITIONS FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE WITH THE CURED PRODUCT THEREOF

摘要

The purpose of the present invention is to provide a resin composition for granting a cured product with excellent reliability that has little pyrolysis (reduction in weight) even if the cured product is left for a long time at high temperatures of 200°C or higher, e.g. at high temperatures of 200 to 250°C, has excellent adhesion to Cu LF or Ag plating, and has excellent mechanical strength at high temperatures. The present invention provides a composition comprising (A) a cyanate ester compound having two or more cyanato groups in a molecule; (B) a phenol compound represented by chemical formula (1); and (C) an inorganic filler, wherein the molar ratio of phenolic hydroxyl groups in the (B) phenol compound is 0.1 to 0.4 with respect to the cyanato groups in the (A) cyanate ester compound. Also, the present invention provides a composition comprising: in addition to (A) to (C) components, (D) a mercaptopropyl group-containing alkoxysilane compound represented by chemical formula 3; (E) a material made by supporting a metal salt of molybdic acid on an inorganic carrier; and (F) a hydrotalcite-like compound and/or a calcined material of a hydrotalcite-like compound. In addition, the present invention provides a composition comprising, in addition to (A) to (C) components, (G) a releasing agent having an acid value of 30 or lower and a saponifiable value of 150 or lower with the proviso that the saponifiable value is equal to or greater than 80 and equal to or smaller than 150 when the acid value is smaller than 5, and the acid value is equal to or greater than 20 and equal to or smaller than 30 when the saponifiable value is smaller than 5.