| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package exhibiting excellent heat resistance and strong resistance against physical shock in which a lead frame and a sealing material are not peeled off easily from a resin molding, and cracking and chipping do not occur. <P>SOLUTION: In the package for a semiconductor light-emitting device having a resin molding and metal wiring, push-in depth of the resin molding when an indenter having a diameter of 500 μm at the tip is pushed in with a force of 50 mN is 4-30 μm, and the Shore D hardness of the resin molding is 25-75. <P>COPYRIGHT: (C)2012,JPO&INPIT |
