发明名称 固体撮像装置の製造方法
摘要 <p>A manufacturing method of a solid-state imaging device includes: preparing a photoelectric conversion device; forming an insulating layer on a surface of the photoelectric conversion device; forming a wire-grid polarizer on a support base; bonding a forming surface of the wire-grid polarizer on the support base to the insulating layer on the surface of the photoelectric conversion device and removing the support base from the wire-grid polarizer.</p>
申请公布号 JP5682312(B2) 申请公布日期 2015.03.11
申请号 JP20110000805 申请日期 2011.01.05
申请人 发明人
分类号 H01L27/14;G02B5/30 主分类号 H01L27/14
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