发明名称 半導体装置及びその製造方法
摘要 <p>A semiconductor device including a first conduction type semiconductor layer; a second conduction type element forming region formed above the first conduction type semiconductor layer and formed with at least one semiconductor element formed on a surface region of the second conduction type element forming region; a first conduction type element-isolation region insulating and segregating the second conduction type element forming region from the exterior; and a second conduction type buried region formed at the interface of the first conduction type semiconductor layer and the second conduction type element forming region, formed separated from the first conduction type element-isolation region. In the semiconductor device a second conduction type high concentration region is buried in the surface of the second conduction type element forming region and formed to surround the semiconductor element and separated from the first conduction type element-isolation region.</p>
申请公布号 JP5684450(B2) 申请公布日期 2015.03.11
申请号 JP20080211937 申请日期 2008.08.20
申请人 发明人
分类号 H01L21/76;H01L21/8234;H01L27/08;H01L27/088 主分类号 H01L21/76
代理机构 代理人
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