| 发明名称 |
Systems and methods for dissipating heat in an enclosure |
| 摘要 |
An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array. |
| 申请公布号 |
US8976525(B2) |
申请公布日期 |
2015.03.10 |
| 申请号 |
US201213562336 |
申请日期 |
2012.07.31 |
| 申请人 |
General Electric Company |
发明人 |
de Bock Hendrik Pieter Jacobus;Gross, Jr. William Earl;Whalen Bryan Patrick;Meier Robert Paul |
| 分类号 |
H05K7/20;F28F13/12;G06F1/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
Katragadda Seema S. |
| 主权项 |
1. An enclosure, comprising:
an outer casing having one or more walls; a synthetic jet assembly configured to dissipate heat from the one or more walls and comprising: a bracket operatively coupled to the one or more walls of the outer casing; and two or more synthetic jets operatively coupled to the bracket such that the two or more synthetic jets are spaced apart from a surface of the one or more walls of the outer casing, wherein the two or more synthetic jets are arranged in a multiple-planes array. |
| 地址 |
Niskayuna NY US |
