发明名称 LIGHT-EMITTING DEVICE MANUFACTURING METHOD
摘要 <p>This invention provides a light-emitting diode chip with high light extraction, which includes a substrate, an epitaxial-layer structure for generating light by electric-optical effect, a transparent reflective layer sandwiched between the substrate and the epitaxial-layer structure, and a pair of electrodes for providing power supply to the epitaxial-layer structure. A bottom surface and top surface of the epitaxial-layer structure are roughened to have a roughness not less than 100 nm root mean square (rms). The light generated by the epitaxial-layer structure is hence effectively extracted out. A transparent reflective layer not more than 5μm rms is formed as an interface between the substrate and the epitaxial-layer structure. The light toward the substrate is more effectively reflected upward. The light extraction and brightness are thus enhanced. Methods for manufacturing the light-emitting diode chip of the present invention are also provided.</p>
申请公布号 KR101501307(B1) 申请公布日期 2015.03.10
申请号 KR20107006534 申请日期 2008.09.17
申请人 发明人
分类号 H01L33/00;H01L33/20;H01L33/22;H01L33/44 主分类号 H01L33/00
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