Post deposition plasma cleaning system and method

摘要

A method for processing a substrate includes disposing the substrate in a deposition chamber configured to perform a deposition process and depositing a film on the substrate using the deposition process. The substrate having the film thereon is then transferred from the deposition chamber into a treatment chamber and a plasma cleaning process is performed on the substrate in the treatment chamber. Further processing of the substrate is performed after the plasma cleaning process.

主权项

1. A method for processing a substrate comprising:
disposing said substrate in a deposition chamber configured to perform a deposition process using plasma, a power of the plasma being varied during the deposition process; depositing a film on said substrate using said deposition process by alternating providing a first process material into the deposition chamber while the plasma is generated with a first power and providing a second process material into the deposition chamber while not providing the first process material and while the plasma is generated with a second power higher than the first power; a first transferring step of transferring said substrate having the film thereon from the deposition chamber into a designated treatment chamber having a slotted plane antenna (SPA); performing a plasma cleaning process on said substrate in said designated treatment chamber; a second transferring step of transferring said substrate to an additional process chamber directly after said plasma cleaning; and performing further processing of said substrate in the additional process chamber.