HIGH-POWER LASER DIODE MODULE AND FABRICATING METHOD THEREOF

摘要

Disclosed are a high-power laser diode module and a manufacturing method thereof. The method according to the present invention includes the steps of: depositing a first solder layer on the upper side of a heat sink for heat dissipation; attaching a first lead and a second lead for supplying electricity; bonding a first laser diode chip on the upper side of the first solder layer to face a first electrode of the first laser diode chip; and bonding a second laser diode chip on the upper side of a second solder layer to face a second electrode of the second laser diode chip after the second solder layer is deposited on the upper side of a second electrode of the first laser diode chip.