发明名称 Adhesive film and flat cable using same
摘要 The adhesive film includes an insulating film, an adhesive layer provided over one side of the insulating film, and an anchor coat layer provided between the one side of the insulating film and the adhesive layer. The adhesive layer is a copolymer polyamide resin which is soluble in a solvent at 25 degrees Celsius and has a melting point of 100 degrees Celsius or more and 150 degrees Celsius or less. The anchor coat layer enhances the adhesion between the insulating film and the adhesive layer.
申请公布号 US8975522(B2) 申请公布日期 2015.03.10
申请号 US201213423619 申请日期 2012.03.19
申请人 Hitachi Metals, Ltd. 发明人 Shanai Daisuke;Abe Tomiya
分类号 H01B7/08;C09J177/08;H01B7/295 主分类号 H01B7/08
代理机构 Roberts Mlotkowski Safran & Cole P.C. 代理人 Roberts Mlotkowski Safran & Cole P.C.
主权项 1. An adhesive film, comprising: an insulating film; an anchor coat layer provided on one side of the insulating film, an adhesive layer having one side provided directly on the anchor coat and the adhesive layer comprising a copolymer polyamide resin which is soluble in a solvent at 25 degrees Celsius and has a melting point of 100 degrees Celsius or more and 150 degrees Celsius or less; and a conductor bonding layer provided on the other side of the adhesive layer, the conductor bonding layer being bondable with a metallic conductor, wherein the anchor coat layer enhances the adhesion between the insulating film and the adhesive layer, and wherein the adhesive layer contains 120 parts by weight or more and 200 parts by weight or less of at least one flame retardant of a bromine compound, a phosphorus compound, a nitrogen compound, and a metal compound, relative to 100 parts by weight of the resin, and wherein the solvent for the adhesive layer comprises a mixture of two solvents, and each of the two solvents comprises a halogen free solvent having a boiling point of 120 degrees Celsius or less.
地址 Tokyo JP