ELECTRIC COMPONENT MODULE AND MANUFACTURING METHOD THREROF

摘要

The present invention relates to an electronic component module capable of improving the degree of integration by mounting electronic parts on both sides of a substrate, and a manufacturing method thereof. For this, an electronic device module according to the embodiment of the present invention may include a first substrate; electronic devices mounted on both sides of the first substrate; a second substrate bonded to the lower side of the first substrate; and a mold part which is formed in the lower side of the first substrate by burying the second substrate.