Circuit board structure

摘要

A circuit board structure for a low noise block down-converter is disclosed. The circuit board structure is used for transmitting a first radio-frequency signal and a second radio-frequency signal across each other, and includes a first substrate and a second substrate. The first substrate includes a first wire for transmitting the first radio-frequency signal, a first grounded wire formed in parallel to a side of the first wire, and a second grounded wire formed in parallel to another side of the first wire. The second substrate is electrically connected to the first substrate, and includes a second wire for transmitting the second radio-frequency signal, a third wire formed on a side of the second wire and a fourth wire formed on another side of the second wire.

主权项

1. A circuit board structure for a low noise block down-converter, and used for transmitting a first radio-frequency signal and a second radio-frequency signal across each other, comprising:
a first substrate comprising:
a first wire for transmitting the first radio-frequency signal;a first grounded wire formed in parallel to one side of the first wire, two ends of the first grounded wire are respectively electrically connected to a first via and a second via; anda second grounded wire formed in parallel to another side of the first wire, two ends of the second grounded wire are respectively electrically connected to a third via and a fourth via; and a second substrate electrically connected to the first substrate, and comprising:
a second wire for transmitting the second radio-frequency signal;a third wire formed on one side of the second wire, and electrically connected to one end of the first wire by a fifth via to transmit the first radio-frequency signal; anda fourth wire formed on another side of the second wire, and electrically connected to another end of the first wire by a sixth via to transmit the first radio-frequency signal; wherein the third wire and the fourth wire are indirectly connected to each other, and the first, second, third, fourth, fifth and sixth vias penetrate the first substrate and the second substrate.