发明名称 Probe for inspecting electronic component
摘要 A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component.
申请公布号 US8975906(B2) 申请公布日期 2015.03.10
申请号 US201013700859 申请日期 2010.07.06
申请人 NTS Co., Ltd. 发明人 Jeong Woo-Yoel
分类号 G01R31/20;G01R1/067 主分类号 G01R31/20
代理机构 Lowe Hauptman & Ham, LLP 代理人 Lowe Hauptman & Ham, LLP
主权项 1. A probe for inspecting electronic components, the probe comprising: a cylinder body having a cylindrical shape; a piston body configured to reciprocate between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and configured to force a part of the piston body to resiliently move out of the cylinder body when the part of the piston body is inserted into the cylinder body; a probing unit extending from the cylinder body, and configured to contact with a target electronic component to be inspected; a contact unit extending from the piston body, and configured to contact with an inspection apparatus which is configured to inspect conduction of electric current of the target electronic component; and a probing body surrounding and holding a probing pin, wherein the probing pin has a unibody structure which includes a hemispherical end portion configured to directly contact with the target electronic component, and an accommodating groove disposed along an outer circumference of the probing pin in a horizontal direction, and wherein the probing body comprises: a securing projection disposed along an inner circumference of the probing body in the horizontal direction, and configured to be accommodated in the accommodating groove.
地址 Cheonan Si, Chungcheongnam-Do KR