发明名称 |
Probe for inspecting electronic component |
摘要 |
A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component. |
申请公布号 |
US8975906(B2) |
申请公布日期 |
2015.03.10 |
申请号 |
US201013700859 |
申请日期 |
2010.07.06 |
申请人 |
NTS Co., Ltd. |
发明人 |
Jeong Woo-Yoel |
分类号 |
G01R31/20;G01R1/067 |
主分类号 |
G01R31/20 |
代理机构 |
Lowe Hauptman & Ham, LLP |
代理人 |
Lowe Hauptman & Ham, LLP |
主权项 |
1. A probe for inspecting electronic components, the probe comprising:
a cylinder body having a cylindrical shape; a piston body configured to reciprocate between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and configured to force a part of the piston body to resiliently move out of the cylinder body when the part of the piston body is inserted into the cylinder body; a probing unit extending from the cylinder body, and configured to contact with a target electronic component to be inspected; a contact unit extending from the piston body, and configured to contact with an inspection apparatus which is configured to inspect conduction of electric current of the target electronic component; and a probing body surrounding and holding a probing pin, wherein the probing pin has a unibody structure which includes a hemispherical end portion configured to directly contact with the target electronic component, and an accommodating groove disposed along an outer circumference of the probing pin in a horizontal direction, and wherein the probing body comprises: a securing projection disposed along an inner circumference of the probing body in the horizontal direction, and configured to be accommodated in the accommodating groove. |
地址 |
Cheonan Si, Chungcheongnam-Do KR |