发明名称 Near field communication antenna device of mobile terminal
摘要 A near field communication antenna device of a mobile terminal is provided. The near field communication antenna device includes a window including a display region for transmitting an image displayed by a display and a black mark region formed around the display region, a multi-layer Flexible Printed Circuit Board (FPCB) on which a plurality of layers are laminated on the lower side of the black mark region of the window, and a spiral loop-shaped antenna pattern in which conductive lines are formed on respective layers of the multi-layer FPCB and are connected to each other. Accordingly, a near field communication antenna is not disposed in a separated installation space, an antenna pattern width can be reduced, and performance of the near field communication antenna may be prevented from being degraded when a battery cover is made of metal or has a curved shape.
申请公布号 US8977196(B2) 申请公布日期 2015.03.10
申请号 US201213562834 申请日期 2012.07.31
申请人 Samsung Electronics Co., Ltd.;Globrf Co., Ltd. 发明人 Cho Kyu Sik;Kim In Sook
分类号 H04B5/00;H01Q7/00;H01Q1/24 主分类号 H04B5/00
代理机构 Jefferson IP Law, LLP 代理人 Jefferson IP Law, LLP
主权项 1. A near field communication antenna device of a mobile terminal, the device comprising: a window including a display region for transmitting an image displayed by a display and a black mark region formed around the display region; a multi-layer Flexible Printed Circuit Board (FPCB) on which a plurality of layers are laminated, the multi-layer FPCB being disposed on a lower side of the black mark region of the window; a spiral loop-shaped antenna pattern in which conductive lines are formed on respective layers of the multi-layer FPCB and are connected to each other; and a closed loop FPCB having a closed loop antenna pattern that is electrically disconnected from the antenna pattern, the closed loop FPCB being laminated so as to be at least one of (i) between at least two layers of the plurality of layers of the multi-layer FPCB, (ii) on an upper side of the multi-layer FPCB, and (iii) on a lower side of the multi-layer FPCB.
地址 Suwon-si KR