| 摘要 |
<p>The present invention relates to a spin chuck and a single wafer type cleaning apparatus equipped with the same and, more specifically, to a spin chuck and a single wafer type cleaning apparatus equipped with the same, wherein the single water type cleaning apparatus is provided to make the spin chuck smoothly work by improving the structure of a chuck pin fixating a substrate. The spin chuck comprises: a chuck forming a support surface to support a substrate; a chuck pin partially exposed from the support surface of the chuck and supporting the side of the substrate; a cam combined with the chuck pin and rotating the chuck pin; and a drive unit combined with the cam and making the cam perform a linear motion. Accordingly, the spin chuck is capable of minimizing fixation defects occurring on the contact surface of the substrate supported by the chuck pin; preventing deviations in the position of the chuck pin due to the thermal deformation of the spin chuck by improving the structure of the chuck pin; and minimizing the size of the spin chuck by improving the structure rotating the chuck pin in the spin chuck.</p> |
